NIR Automatic Inspection Microscope

NIR Automatic Inspection Microscope

Details

The McBain NIR 200 is a fully-automated near-infrared inspection system for extracting wafers from a source cassette and measuring multiple alignment targets with 0.5 micron repeatability. The tool can be run in manual, local auto or full remote through GEM/SECS.

NIR Automatic Inspection Microscope

Features:

  • Automatic loading and unloading of 4″, 6″ and 8″ wafers
  • Motorized X, Y, Z and theta axis
  • 900nm to 1700nm custom optical system provides best-in-class NIR visibility
  • Highly sensitive InGaAs camera
  • Integrated vision system and customizable software for:
    • Image optimization
    • Part recipe
    • Palletization
    • Critical measurements
    • Defect detection and classification
  • 6 inches of vertical Z travel allows custom tooling
  • 6″, 8″ or 12″ travel XY stage options
    • solid reflected or transmitted light
    • manual coarse, fine or motorized options
  • 0.5 micron feature resolution
  • 0.1 micron positioning accuracy and repeatability
  • Turnkey integrated motion control packages
  • Ergonomic 3 axis joystick and trackball controls
  • Vibration isolation
  • Custom configurations available

Fully-automatic Measuring and Alignment Microscope and Handling System

The McBain NIR 200 is a fully-automated near-infrared inspection system for extracting wafers from a source cassette and measuring multiple alignment targets with 0.5 micron repeatability. The tool can be run in manual, local auto or full remote through GEM/SECS.

The NIR200 is a reliable production tool that is highly configurable to end-user needs. Throughput is partly dependent on the number of sites per wafer; a nine-site inspection set-up can run a cassette of 25 wafers in 45 minutes. The NIR200 is best-in-class for wafer-to-wafer and die-to-die critical alignment measurement and verification. This unique tool has been sold into many industries and a range of applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.

See also the semi-automatic version of this tool.

We can ship this item worldwide. If you would like a specific quote and estimated delivery time, contact us today.