Semi-automatic Measuring and Alignment System
The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
See also the fully-automated version of this tool.
We can ship this item worldwide. If you would like a specific quote and estimated delivery time, contact us today.