Fully-automatic Measuring and Alignment Microscope and Handling System
The McBain NIR 200 is a fully-automated near-infrared inspection system for extracting wafers from a source cassette and measuring multiple alignment targets with 0.5 micron repeatability. The tool can be run in manual, local auto or full remote through GEM/SECS.
The NIR200 is a reliable production tool that is highly configurable to end-user needs. Throughput is partly dependent on the number of sites per wafer; a nine-site inspection set-up can run a cassette of 25 wafers in 45 minutes. The NIR200 is best-in-class for wafer-to-wafer and die-to-die critical alignment measurement and verification. This unique tool has been sold into many industries and a range of applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
See also the semi-automatic version of this tool.
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