McBain DDR200/300 NIR-SWIR Infrared Microscope

Near Infrared Subsurface Defect Detection and Review Systems

The McBain DDR200 NIR (for 200mm) and DDR300 NIR (for 300mm) provide high-speed defect detection and precision measurement on wafers and other parts. These cost-efficient systems offer unique advantages for both production and process development use, providing an optimum near-infrared (900-1700nm) solution when both subsurface defect detection and dimensional metrology are required.

These DDR systems feature a powerful set of automated and semi-automated optical and digital video tools, which are optimized for high accuracy, production throughput and ease of use. The automated and versatile platform features McBain’s state-of-the-art near-infrared Koehler Epi-illumination as well as optional transmitted-illumination packages. All systems are configured on McBain Systems’ precision multi-axis platforms.


  • For in-process, post-process and failure analysis
  • Bonded wafer alignment
  • Die alignment (flip-chip or hybridization)
  • Subsurface defect visualization, detection, characterization
  • MEMS device inspection and metrology
  • 3D stacking process development and control

Key Features

  • Designed for automatic / semiautomatic operation
  • Extensive defect detection features and capability
  • Integrated dimensional metrology features
  • Able to penetrate thicker materials, more highly doped materials and rougher surfaces than other systems
  • Submicron-precision optical measurements
  • High-accuracy staging, to 20nm linear encoder resolution
  • Highest resolution 900-1700nm InGaAs digital camera in class
  • High-speed linear servo motor staging
  • 50-500 defects/measurement/second per field of view, typical
  • Very easy to use, program and set up
  • Multiple wafer/die/part handling systems available
  • Application-specific customizable software
  • Semi Standard S2/S8 compliant