Wafer Measuring Microscope

  • Thickness measurement accuracies as low as 0.3µm
  • Point of inspection spot sizes down to 20µm
  • Up to 200mm (8″) wafer capacity (consult McBain for larger applications)
  • Capable of throughputs of greater than 3600 points per hour.
  • Integrated optical system allows optional OCR and visual inspection software
  • Custom tooling available
  • Platform can be integrated with other software packages to allow multiple functions to be performed: defect detection, FOV measurements, metrology measurements and more
  • Optional safety light curtain
  • Can be fully automated by integrating a wafer handling system